Plastics with integrated microelectronic systems could revolutionize cell phones and mobile systems in the future. In the Ore Mountains, companies are working on such visions together with the Institute for Structural Lightweight Design at Chemnitz University of Technology (TU). The STRUKTRONIK project is exploring the possibilities of embedding microelectric systems in thermoplastic composites, which could significantly increase their functionality.
Dr. Jens Emmrich, head of the research area for active materials and composite structures at TU Chemnitz, is enthusiastic about the potential of the new technology. Until now, electronic components have been retrofitted into components, making it difficult to protect sensitive technology. However, by using organosheets and structure-supporting circuit boards, major advances could be made in the production and protection of the technology.
The potential applications of the new technology are diverse and spectacular. Dr. Emmrich sees future areas of application particularly in lightweight construction and electromobility. The goal of the STRUKTRONIK project is to develop a technology capable of large-scale production that enables additional functions in housings and replaces metals.
The collaboration between the participating companies and researchers is shaping up successfully. To date, the project team has conducted basic research such as material selection and process adaptation, and manufactured an initial prototype. The participating companies each contribute their individual technological competencies and benefit from each other through the exchange of knowledge and experience.
The companies involved include BERND FLACH Präzisionstechnik, EDC Electronic Design Chemnitz, Komitec electronics and KSG GmbH. Each company contributes its specific know-how in plastic injection molding, circuit design, PCB assembly and soldering or PCB manufacturing. Together, they hope to develop key technologies for a new kind of three-dimensional and versatile printed circuit boards.
